EP7309-CVZ View Datasheet(PDF) - Cirrus Logic

Part Name

Description

MFG CO.

EP7309-CVZ

High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface

Cirrus Logic 

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204-Ball TFBGA Package Characteristics

204-Ball TFBGA Package Specifications

TOP VIEW

A1 CORNER

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

A

B

C

D

E

F

G

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M

N

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Y

C

SEATING PLANE

EP7309

High-Performance, Low-Power System on Chip

Ø0.08 M

C

Ø0.15 M C A

B

Ø0.25~0.35(204X)

BOTTOM VIEW

A1 CORNER

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

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A

B

12.35

13±0.05

0.65

0.15(4X) C

Ball Pitch :

Ball Diameter :

0.65

0.3

Substrate Thickness :

0.36

Mold Thickness

:

0.53

Figure 13. 204-Ball TFBGA Package

DS507F1

©Copyright Cirrus Logic, Inc. 2005

(All Rights Reserved)

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