EP7309-IBZ View Datasheet(PDF) - Cirrus Logic
Part Name
Description
MFG CO.
EP7309-IBZ
Cirrus Logic
'EP7309-IBZ' PDF : 51 Pages View PDF
EP7309
High-Performance, Low-Power System on Chip
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
Pin 1 Corner
17.00 (0.669)
±0.20 (.008)
15.00 (0.590)
D1 ±0.20 (.008)
17.00 (0.669)
±0.20 (.008)
E1
15.00 (0.590)
±0.20 (.008)
Pin 1 Indicator
30° TYP
0.85 (0.034)
±0.05 (.002)
0.40 (0.016)
±0.05 (.002)
TOP VIEW
2 Layer
0.36 (0.014)
±0.09 (0.004)
SIDE VIEW
1.00 (0.040)
REF
1.00 (0.040)
REF
1.00 (0.040)
D
17.00 (0.669)
1.00 (0.040)
E
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Pin 1 Corner
17.00 (0.669)
0.50
R
3 Places
BOTTOM VIEW
JEDEC #: MO-151
Ball Diameter: 0.50 mm ± 0.10 mm
17 ¥ 17 ¥ 1.61 mm body
Figure 14. 256-Ball PBGA Package
Note: 1) For pin locations see Table 21.
2) Dimensions are in millimeters (inches), and controlling dimension is millimeter
3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
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©Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
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