ESDA14V2-4BF3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ESDA14V2-4BF3' PDF : 8 Pages View PDF
ESDA14V2-4BF3
3
Ordering information scheme
Ordering information scheme
Figure 11. Ordering information scheme
ESDA 14V2 - 4 B Fx
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip Chip
x = 3: lead-free, pitch = 400µm, bump height = 255 µm
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 12. Package dimensions
185 µm ± 10
565 µm ± 40
255 µm ± 40
605 µm ± 55
185 µm
0.935 mm ± 30µm
5/8
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