ESDALC14V2-1U2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ESDALC14V2-1U2' PDF : 11 Pages View PDF
Recommendation on PCB assembly
4
Recommendation on PCB assembly
ESDALC14V2-1U2
4.1
Stencil opening design
Figure 17. Recommended stencil windows position (dimensions in mm)
0.425
1.05
0.425
0.225
0.30
0.040
0.065 0.20
Footprint
0.038
0.320 0.038
Stencil window
4.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
8/11
Doc ID 15090 Rev 3
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