ESDALC5-1BM2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'ESDALC5-1BM2' PDF : 14 Pages View PDF
ESDALC5-1BM2, ESDALC5-1BT2
Recommendation on PCB assembly
3
Recommendation on PCB assembly
3.1
Stencil opening design
1. General recommendation on stencil opening design
a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
a. Stencil thickness (T) = 75 ~ 125 μm
b. Aspect ratio = �� ≥ 1.5
��
c.
Aspect
area
=
����
2��(��+��)
≥
0.66
3. Reference design
a. Stencil opening thickness: 100 μm
b. Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 23: Stencil opening dimensions
L
TW
Figure 24: Recommended stencil window position in mm (inches)
3.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-38 μm.
DocID16936 Rev 6
9/13
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