ESDALC6V1-1BU2 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

ESDALC6V1-1BU2

Single-line low capacitance Transil™ for bidirectional ESD protection

STMicroelectronics 

1 2 3 4 5 6 7 8 9 10

Recommendation on PCB assembly

4

Recommendation on PCB assembly

4.1

Stencil opening design

Figure 15. Recommended stencil windows position

ESDALC6V1-1BU2

0.425

1.05

0.425

0.225

0.30

0.040

0.065 0.20

Footprint

0.038

0.320 0.038

Stencil window

4.2

Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed

4. Solder paste with fine particles: powder particle size is 20-45 µm.

8/11

Doc ID 15583 Rev 3

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