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EVAL-AD5144DBZ View Datasheet(PDF) - Analog Devices

Part Name
Description
MFG CO.
'EVAL-AD5144DBZ' PDF : 36 Pages View PDF
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Data Sheet
AD5124/AD5144/AD5144A
OUTLINE DIMENSIONS
PIN 1
INDICATOR
AREA
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
SIDE VIEW
0.50
BSC
0.30
0.25
0.20
19
18
24
1
EXPOSED
PAD
DETAIL A
(JEDEC 95)
PIN 1
IN D IC ATO R AR E A OP T IO N S
(SEE DETAIL A)
2.20
2.10 SQ
2.00
13
6
0.50
0.40
12
7
BOTTOM VIEW
0.20 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.203 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8
Figure 51. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-24-10)
Dimensions shown in millimeters
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
0.15
1.20 MAX
0.20
0.05
0.09
0.75
0.30
COPLANARITY 0.19
SEATING
0.60
0.45
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 52. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Rev. C | Page 33 of 36
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