EVAL-AD5338RDBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-AD5338RDBZ' PDF : 27 Pages View PDF
AD5338R
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.75
1.60 SQ
1.45
9
4
0.50
8
5
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 53. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 54. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model1
AD5338RBCPZ-RL7
AD5338RBRUZ
AD5338RBRUZ-RL7
EVAL-AD5338RDBZ
Resolution
10 Bits
10 Bits
10 Bits
Temperature
Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Accuracy
±1 LSB INL
±1 LSB INL
±1 LSB INL
1 Z = RoHS Compliant Part.
Reference
Temperature
Coefficient
(ppm/°C)
±5 (max)
±5 (max)
±5 (max)
Package
Description
16-Lead LFCSP_WQ
16-Lead TSSOP
16-Lead TSSOP
Evaluation Board
Package
Option
CP-16-22
RU-16
RU-16
Branding
DKX
Rev. A | Page 26 of 27
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