Data Sheet
OUTLINE DIMENSIONS
3.10
3.00
2.90
3.10
3.00
2.90
10
6
5.15
4.90
4.65
1
5
PIN 1
IDENTIFIER
0.50 BSC
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
COPLANARITY
0.30
0.15
6°
0.23
0°
0.13
0.70
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 36. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
2.48
2.38
2.23
6
DETAIL A
(JEDEC 95)
0.50 BSC
10
TOP VIEW
0.50
0.40
0.30
EXPOSED
PAD
1.74
1.64
1.49
5
1
BOTTOM VIE W
0.20 MIN
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
SIDE VIEW
0.30
0.25
0.20
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 37. 10-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-10-9)
Dimensions shown in millimeters
AD5541A
Rev. B | Page 19 of 20