AD5541A
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
2.44
2.34
2.24
DETAIL A
(JEDEC 95)
0.50 BSC
TOP VIEW
0.50
0.40
0.30
5
8
EXPOSED
PAD
4
1
BOTTOM VIEW
1.70
1.60
1.50
0.20 MIN
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
SIDE VIEW
0.30
0.25
0.20
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET
COMPLIANT TO JEDEC STANDARDS MO-229-W3030D-4
Figure 38. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-11)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model1
AD5541ABRMZ
AD5541ABRMZ-REEL7
AD5541AARMZ
AD5541AARMZ-REEL7
AD5541AACPZ-REEL7
AD5541ABCPZ-REEL7
AD5541ABCPZ-500RL7
AD5541ABCPZ-1-RL7
EVAL-AD5541ASDZ
INL
±1 LSB
±1 LSB
±2 LSB
±2 LSB
±2 LSB
±1 LSB
±1 LSB
±1 LSB
1 Z = RoHS Compliant Part.
DNL
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
±1 LSB
Power-On
Reset to Code
Zero Scale
Zero Scale
Zero Scale
Zero Scale
Zero Scale
Zero Scale
Zero Scale
Zero Scale
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP
10-Lead LFCSP
10-Lead LFCSP
8-Lead LFCSP
AD5541A Evaluation Board
Package
Option
RM-10
RM-10
RM-10
RM-10
CP-10-9
CP-10-9
CP-10-9
CP-8-11
Marking
Code
DEQ
DEQ
DER
DER
DER
DEQ
DEQ
DFG
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D08516-0-4/18(B)
Rev. B | Page 20 of 20