EVAL-AD5697RSDZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-AD5697RSDZ' PDF : 28 Pages View PDF
AD5697R
OUTLINE DIMENSIONS
Data Sheet
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.75
1.60 SQ
1.45
9
4
0.50
8
5
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 53. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 54. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD5697RBCPZ-RL7
AD5697RBRUZ
AD5697RBRUZ-RL7
Resolution
12 Bits
12 Bits
12 Bits
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Accuracy
±1 LSB INL
±1 LSB INL
±1 LSB INL
Reference
Temperature
Coefficient
(ppm/°C)
±5 (max)
±5 (max)
±5 (max)
Package Description
16-Lead LFCSP_WQ
16-Lead TSSOP
16-Lead TSSOP
Package
Option
CP-16-22
RU-16
RU-16
Branding
DKY
1 Z = RoHS Compliant Part.
Rev. B | Page 26 of 27
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