EVAL-AD7783EB View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
EVAL-AD7783EB
Analog Devices
'EVAL-AD7783EB' PDF : 12 Pages View PDF
AD7783
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 1. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD7783BRU
AD7783BRU-REEL
AD7783BRU-REEL7
AD7783BRUZ
AD7783BRUZ-REEL7
EVAL-AD7783EBZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Evaluation Board
1 Z = RoHS Compliant Part.
REVISION HISTORY
10/11—Rev. B to Rev. C
Changes to Figure 2...........................................................................5
Changes to Ordering Guide...........................................................10
8/04—Data Sheet Changed from Rev. A to Rev. B.
Change to Features............................................................................1
Changes to Ordering Guide.............................................................5
4/03—Data Sheet Changed from Rev. 0 to Rev. A.
Change to Specifications ..................................................................2
Updated Outline Dimensions........................................................10
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
Rev. C | Page 10 of 12
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