AD7796/AD7797
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 18. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD7796BRUZ1
AD7796BRUZ-REEL1
AD7797BRUZ1
AD7797BRUZ-REEL1
EVAL-AD7796EB
EVAL-AD7797EB
1 Z = Pb-free part.
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
Evaluation Board
Evaluation Board
Package Option
RU-16
RU-16
RU-16
RU-16
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06083-0-8/06(A)
Rev. A | Page 24 of 24