EVAL-AD7879EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-AD7879EBZ' PDF : 36 Pages View PDF
AD7879/AD7889
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VCC to GND
Analog Input Voltage to GND
AUX/VBAT to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Input Current to Any Pin Except Supplies1
ESD Rating (X+, Y+, X−, Y−)
Air Discharge Human Body Model
Contact Human Body Model
ESD Rating (All Other Pins)
Human Body Discharge
Field-Induced Charged Device Model
Machine Model
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Power Dissipation
WLCSP (4-Layer Board)
LFCSP (4-Layer Board)
IR Reflow Peak Temperature
Lead Temperature (Soldering 10 sec)
Rating
−0.3 V to +3.6 V
−0.3 V to VCC + 0.3 V
−0.3 V to +5 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
10 mA
15 kV
10 kV
4 kV
1 kV
0.2 kV
−40°C to +85°C
−65°C to +150°C
150°C
866 mW
2.138 W
260°C (±0.5°C)
300°C
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type1
12-Ball WLCSP
16-Lead LFCSP
1 4-layer board.
θJA
Unit
75
°C/W
30.4
°C/W
200µA
IOL
TO OUTPUT
PIN CL
50pF
1.4V
200µA
IOH
Figure 4. Circuit Used for Digital Timing
ESD CAUTION
Rev. D | Page 6 of 40
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