OUTLINE DIMENSIONS
AD7986
4.00
BSC SQ
PIN 1
INDICATOR
TOP VIEW
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.60 MAX
0.60 MAX
3.75
BSC SQ
0.50
BSC
0.50
0.40
0.30
15 16
20
1
EXPOSED
PAD
(BOTTOM VIEW)
10
11
5
6
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
0.25 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2, 3
AD7986BCPZ
AD7986BCPZ-RL7
EVAL-AD7986EBZ
EVAL-CED1Z
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7” Tape and Reel
Evaluation Board
Converter Evaluation and Development Board
Package
Option
CP-20-4
CP-20-4
Ordering
Quantity
490
1,500
1 Z = RoHS Compliant Part.
2 The EVAL-AD7986EBZ can be used as a standalone evaluation board or in conjunction with the EVAL-CED1Z for evaluation/demonstration purposes.
3 The EVAL-CED1Z allows a PC to control and communicate with all Analog Devices evaluation boards ending in the EB designator.
Rev. B | Page 27 of 28