EVAL-ADG772EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
EVAL-ADG772EBZ
Analog Devices
'EVAL-ADG772EBZ' PDF : 12 Pages View PDF
ADG772
OUTLINE DIMENSIONS
0.20 DIA
TYP
0.60
0.55
0.50
SEATING
PLANE
1.30
1.60
TOP VIEW
0.55
0.40
0.30 9
1
0.40
BSC
6
4
BOTTOM VIEW
PIN 1
IDENTIFIER
0.35
0.30
0.25
0.20 BSC
0.05 MAX
0.02 NOM
Figure 31. 10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)
1.30 mm × 1.60 mm Body, Ultra Thin Quad
(CP-10-10)
Dimensions shown in millimeters
3.00
BSC SQ
0.75
0.55
0.60 MAX
0.35
PIN 1
INDICATOR
TOP
VIEW
0.45
2.75
BSC SQ
10
9
11
12 1
8
2
EXPOSED PAD
(BOTTOM VIEW)
7
3
654
12° MAX
1.00
0.85
0.80
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.50
BSC
SEATING
PLANE
0.30
0.23
0.20 REF
COPLANARITY
0.08
0.18
PIN 1
INDICATOR
*1.45
1.30 SQ
1.15
0.25 MIN
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 32. 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
ADG772BCPZ-1REEL1 –40°C to +85°C
ADG772BCPZ-REEL1 –40°C to +85°C
ADG772BCPZ-REEL71 –40°C to +85°C
EVAL-ADG772EBZ1 –40°C to +85°C
1 Z = RoHS Compliant Part.
Package Description
12-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)
10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)
Evaluation Board
Package Option
CP-12-1
CP-10-10
CP-10-10
Branding
S2P
B
B
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06692-0-8/07(0)
Rev. 0 | Page 12 of 12
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