EVAL-ADG888EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-ADG888EBZ' PDF : 17 Pages View PDF
ADG888
OUTLINE DIMENSIONS
BALL 1
IDENTIFIER
2.06
2.00 SQ
1.94
TOP VIEW
(BALL SIDE DOWN)
0.65
0.59
0.53
SEATING
PLANE
0.36
0.32
0.28
0.50
BALL
PITCH
0.28
0.11
0.24
0.09
0.20
0.07
D
C
B
A
1
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
Figure 26. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.30
0.80
SEATING
PLANE
0.23
0.18
0.60 MAX
3.75
BSC SQ
0.65 BSC
0.75
0.60
0.50
0.60 MAX
PIN 1
INDICATOR
13
16
12
1
EXPOSED
PAD
(BOTTOM VIEW)
9
4
8
5
2.25
2.10 SQ
1.95
0.25 MIN
1.95 BSC
0.05 MAX
0.02 NOM
0.20 REF COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 28. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
Rev. A | Page 12 of 16
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