EVAL-ADG888EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-ADG888EBZ' PDF : 17 Pages View PDF
ADG888
ORDERING GUIDE
Model
ADG888YRUZ2
ADG888YRUZ-REEL2
ADG888YRUZ-REEL72
ADG888YCPZ-REEL2
ADG888YCPZ-REEL72
ADG888BCBZ-REEL2
ADG888BCBZ-REEL72
EVAL-ADG888EB
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
1 Branding on these packages is limited to three characters due to space constraints.
2 Z = Pb-free part.
Package Option
RU-16
RU-16
RU-16
CP-16-4
CP-16-4
CB-16
CB-16
Branding1
S0D
S0D
S02
S02
Rev. A | Page 13 of 16
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