EVAL-ADG918EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
EVAL-ADG918EBZ
Analog Devices
'EVAL-ADG918EBZ' PDF : 16 Pages View PDF
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
3.20
3.00
2.80 1
5 5.15
4.90
4.65
4
PIN 1
0.65 BSC
0.95
0.85
1.10 MAX
0.75
0.15 0.38
0.00 0.22
0.80
0.23
0.08
8°
0°
0.60
0.40
COPLANARITY SEATING
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
PIN 1
INDICATOR
3.25
3.00 SQ
2.75
TOP
VIEW
0.60 MAX
0.60 MAX
0.50
BSC
2.95
2.75 SQ
2.55
5
8
EXPOSED
PAD
(BOTTOM VIEW)
1.60
1.45
1.30
12° MAX
0.90 MAX
0.85 NOM
SEATING
PLANE
0.70 MAX
0.65 TYP
0.30
0.23
0.18
0.50
0.40
0.30
0.05 MAX
0.01 NOM
0.20 REF
4
1
PIN 1
1.89 INDICATOR
1.74
1.59
EXPOSED PAD IS CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ADG918/ADG919
Rev. C | Page 15 of 16
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