ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
VDD to GND
Inputs to GND
Continuous Current
Input Power
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
θJA Thermal Impedance
LFCSP Package
θJA Thermal Impedance (2-layer board)
θJA Thermal Impedance (4-layer board)
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
–0.5 V to +4 V
–0.5 V to VDD + 0.3 V1
30 mA
18 dBm
–40°C to +85°C
–65°C to +150°C
150°C
206°C/W
84°C/W
48°C/W
300°C
235°C
1 kV
1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V.
ADG918/ADG919
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. C | Page 5 of 16