ADG936/ADG936-R
OUTLINE DIMENSIONS
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
0.15
1.20 MAX
0.20
0.05
0.09
0.75
0.30
COPLANARITY 0.19
8°
SEATING
0°
0.60
0.45
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153AC
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
4.00
BSC SQ
0.60
MAX
PIN 1
INDICATOR
TOP
VIEW
3.75
BCS SQ
0.60
MAX
16
20
15
1
EXPOSED
PAD
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.50
BSC
0.80 MAX
0.65 TYP
0.20
REF
0.75
0.55
0.35
0.05 MAX
0.02 NOM
11
5
10
6
0.30
0.23
0.18
COPLANARITY
0.08
2.25
2.10 SQ
1.95
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body
(CP-20-1)
Dimensions shown in millimeters
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