EVAL-ADG936EBZ View Datasheet(PDF) - Analog Devices

Part Name

Description

MFG CO.

EVAL-ADG936EBZ

Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS, 1.65 V to 2.75 V, Dual SPDT

Analog Devices

'EVAL-ADG936EBZ' PDF : 16 Pages View PDF

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ADG936/ADG936-R
ORDERING GUIDE
Model1
ADG936BRU
ADG936BRU-500RL7
ADG936BRUZ
ADG936BRUZ-REEL
ADG936BRUZ-REEL7
ADG936BCPZ
ADG936BCPZ-RL
ADG936BCPZ-RL7
EVAL-ADG936EBZ
ADG936BRU-R
ADG936BRU-R-500RL7
ADG936BRU-R-REEL
ADG936BRU-R-REEL7
ADG936BRUZ-R
ADG936BCPZ-R
ADG936BCPZ-R-REEL
EVAL-ADG936REBZ
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1 Z = RoHS Compliant Part.
2 CP-20-6 package was formerly CP-20-1 package
Package Description
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
Evaluation Board
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
Evaluation Board
Data Sheet
Package Option2
RU-20
RU-20
RU-20
RU-20
RU-20
CP-20-6
CP-20-6
CP-20-6
RU-20
RU-20
RU-20
RU-20
RU-20
RU-20
CP-20-6
CP-20-6
RU-20
Rev. B | Page 14 of 16

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