ADM1073
OUTLINE DIMENSIONS
5.10
5.00
4.90
14
8
4.50
4.40
4.30
1
6.40
BSC
7
PIN 1
1.05
0.65
1.00
BSC
0.80
1.20 0.20
MAX 0.09
0.75
0.15 0.30
0.05 0.19
SEATING
PLANE
8°
0°
COPLANARITY
0.10
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 49. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADM1073ARU
ADM1073ARU-REEL
ADM1073ARU-REEL7
EVAL-ADM1073EB
EVAL-ADM1073MEB
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
Main Evaluation Board and Micro Evaluation Board1
Micro Evaluation Board ONLY
1 Includes Main Evaluation Board for bench evaluation and Micro Evaluation Board for in-system evaluation.
Package Option
RU-14
RU-14
RU-14
Rev. 0| Page 22 of 24