GL6ZJ27 View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'GL6ZJ27' PDF : 11 Pages View PDF
DG996048
MODEL No.
GL6ZJ27
I Jud16/99
( PAGE
g/10
7. Precautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forsed before soldering.
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7 - 2. Notice of installation
d~cn formint
c
7-2-l installation on a P W B
Vhen mounting an LED lamp on a PW.do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PllB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
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l Bhen positioning an LED lamp,basically employ
an LEDwith tie-bar cut or use a spacer.
7-2-2 !Yhenan LED1 is mounted directly on a PWB
If the bottom face of an LED lamp is mounted
directly on single-sided PVE$the base of the
lead pins maybe subjected to physical stress
due to PWBwarp,cutting or clinching of lead
Good
pins. Prior to’ use, be sure to check that no
disconnection inside of the resin or damageto
resin etc.,is found.Yhen an LED lamp is mounted
on a double-sided PTBthe heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mmafloat above the PWB.
0
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
I
used,a holder should be designed not to subject
lead pins to any undue stress.
!. 6mm
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
c
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
I
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the ins ide of resin
to any undue stress.
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