GP1S25J0000F View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
GP1S25J0000F
Sharp Electronics
'GP1S25J0000F' PDF : 11 Pages View PDF
■ Manufacturing Guidelines
● Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
GP1S25J0000F
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 Hour
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fix temporarily the products to substrate.
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
200˚C
1 to 4˚C/s
MAX
160˚C
25˚C
1 to 4˚C/s
MAX120s
8
1 to 4˚C/s
MAX10s
MAX60s
MAX90s
Sheet No.: D3-A00102EN
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