GS-BT2416C1.AT1 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'GS-BT2416C1.AT1' PDF : 38 Pages View PDF
Soldering
9
Soldering
GS-BT2416C1.AT1
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 8. Soldering
Profile feature
PB free assembly
Average ramp up rate (TSMAX to TP)
3 °C / sec max
Preheat
Temperature min (TS min)
150 °C
Temperature max (TS max)
200 °C
Time (tS min to tS max) (tS)
) Time maintained above:
t(s Temperature TL
c Time tL
u Peak temperature (Tp)
rod Time within 5 °C of actual peak temperature (tP)
P Ramp down rate
te Time from 25 °C to peak temperature
Obsolete Product(s) - Obsole Figure 9. Soldering
60 – 100 sec
217 °C
40 – 70 sec
240 + 0 °C
10 – 20 sec
6 °C / sec
8 minutes max
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