HC4P5524-5 View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
MFG CO.
'HC4P5524-5' PDF : 12 Pages View PDF
HC-5524
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
0.004 (0.10) C
0.025 (0.64)
0.045 (1.14)
R
N44.65 (JEDEC MS-018AC ISSUE A)
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.165
0.180
4.20
4.57
-
CL
E1 E
D2/E2
D2/E2
VIEW “A”
A1
0.090
0.120
2.29
3.04
-
D
0.685
0.695 17.40
17.65
-
D1
0.650
0.656 16.51
16.66
3
D2
0.291
0.319
7.40
8.10
4, 5
E
0.685
0.695 17.40
17.65
-
E1
0.650
0.656 16.51
16.66
3
0.020 (0.51) MAX
3 PLCS
D1
D
0.026 (0.66)
0.032 (0.81)
0.020 (0.51)
E2
MIN
N
A1
A
-C-
SEATING
PLANE
0.013 (0.33)
0.021 (0.53)
0.291
0.319
44
7.40
8.10
4, 5
44
6
Rev. 1 3/95
NOTES:
0.045 (1.14)
MIN
0.025 (0.64)
MIN
VIEW “A” TYP.
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
11
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