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HCC4503BK View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
HCC4503BK
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'HCC4503BK' PDF : 24 Pages View PDF
HCC4xxx
Package mechanical data
Table 9. Ceramic DIL-24 package dimensions
mm
Dim
Min
Typ
A
2.159
1.931
a1
1.270
1.016
a2
0.307
0.274
B
1.270
b1
0.457
0.407
b2
.254
0.229
C
2.466
2.205
D
30.48
30.17
E
15.24
14.98
e
2.540
2.410
e3
27.94
27.81
F
15.11
14.85
K
12.80
12.60
K1
12.80
12.60
L
3.300
3.000
Figure 7. Ceramic DIL-24 package drawings
Max
2.387
1.524
0.340
0.507
0.304
2.727
30.78
15.49
2.670
28.06
15.36
13.00
13.00
3.800
Note:
0016179I
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not affect
the electrical characteristics.
Doc ID 17102 Rev 3
15/24
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