HCPL-0870 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
'HCPL-0870' PDF : 28 Pages View PDF
Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Input Voltage
Output Voltage
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
Min.
Max.
Units
TS
-55
+125
°C
TA
-40
+85
°C
VDD
0
5.5
V
All Inputs
-0.5
VDD + 0.5
V
All Outputs
-0.5
VDD + 0.5
V
260°C for 10 seconds, 1.6 mm below seating plane
See Reflow Thermal Profile
Note:
17. HP recommends the use of non-chlorinated solder fluxes.
Note
17
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltage
Input Voltage
Symbol
TA
VDD
All Inputs
Min.
-40
4.5
0
Max.
+85
5.5
VDD
Units
°C
V
V
Note
1-275
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