HCPL-181-00BE View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'HCPL-181-00BE' PDF : 6 Pages View PDF
Package Outline Drawings
HCPL-181-000E
2.54
± 0.25
181
LEAD
FREE
Y WW
DATE CODE
4.40 ± 0.2
RANK
DIMENSIONS IN MILLIMETERS.
HCPL-181-060E
2.54
± 0.25
181 V
DATE CODE
LEAD
FREE
Y WW
4.40 ± 0.2
RANK
DIMENSIONS IN MILLIMETERS.
3.60 ± 0.3
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
3.60 ± 0.3
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
5.30 ± 0.3
7.00
+
–
0.2
0.7
5.30 ± 0.3
+ 0.2
7.00 – 0.7
0.2 ± 0.05
0.2 ± 0.05
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within the
condition of temperature and time profile shown at
right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package of
the device within the condition of (1) above.
250°C
217°C
200°C
30 seconds
260°C (Peak Temperature)
150°C
60 sec
25°C
60 ~ 150 sec
90 sec
60 sec
Time (sec)
Note: Non-halide flux should be used.
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