HCPL-2502 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
'HCPL-2502' PDF : 16 Pages View PDF
8
Absolute Maximum Ratings
Parameter
Storage Temperature*
Operating Temperature*
Average Forward Input Current*
Peak Forward Input Current*
(50% duty cycle, 1 ms pulse width)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current*
(≤ 1 µs pulse width, 300 pps)
Reverse LED Input Voltage* (Pin 3-2)
Input Power Dissipation*
Average Output Current* (Pin 6)
Peak Output Current*
Emitter-Base Reverse Voltage*
(Pin 5-7, except 4502/3, 0452/3)
Supply Voltage (Pin 8-5)
Output Voltage (Pin 6-5)
Supply Voltage* (Pin 8-5)
Output Voltage* (Pin 6-5)
Base Current* (Pin 7, except 4502/3, 0452/3)
Output Power Dissipation*
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
up to seating plane, 10 seconds
Reflow Temperature Profile
Symbol
TS
TA
IF(AVG)
IF(PEAK)
IF(TRANS)
VR
PIN
IO(AVG)
IO(PEAK)
VEBR
VCC
VO
VCC
VO
IB
PO
TLS
TRP
Device
8-Pin DIP
SO-8
Widebody
Min.
-55
- 55
-55
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
8-Pin DIP
SO-8
Widebody
Max.
125
100
Units Note
°C
°C
85
25 mA 1
2
50 mA
40
1
A
0.1
5
V
3
45 mW 3
40
8
mA
16 mA
5
V
-0.5 30
V
-0.5 20
V
-0.5 15
V
-0.5 15
V
5
mA
100 mW 4
8-Pin DIP
Widebody
SO-8 and
Option 300
260
°C
260
°C
See Package Outline
Drawings section
*Data has been registered with JEDEC for the 6N135/6N136.
Share Link: 
