HCPL-543X View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
'HCPL-543X' PDF : 12 Pages View PDF
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
1
VCC 8
2
VE 7
3
6
VO
4
5
GND
8 Pin DIP
Through Hole
2 Channels
1
VCC 8
VO1
2
7
VO2
3
6
4
5
GND
20 Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2
13
20
GND2 12
2
VO1VCC1 10
3
GND1
78
Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate VCC and ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
1-526
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