HCPL-7840 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
'HCPL-7840' PDF : 12 Pages View PDF
Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Regulatory Information
The HCPL-7840 has been
approved by the following
organizations:
UL Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA Approved under CSA
Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(IO1)
L(IO2)
CTI
Value Units
7.1 mm
7.4 mm
0.08 mm
200 Volts
IIIa
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Steady-State Input Voltage
2 Second Transient Input Voltage
Output Voltages
Lead Solder Temperature
(10 sec., 1.6 mm below seating plane)
Solder Reflow Temperature Profile
Symbol
TS
TA
VDD1, VDD2
VIN+, VIN-
VOUT+, VOUT-
TLS
Min.
-55
-40
0.0
-2.0
-6.0
-0.5
Max.
125
85
5.5
VDD1 +0.5
VDD2 +0.5
260
Unit
°C
°C
V
V
V
°C
Note
1
See Maximum Solder Reflow Thermal Profile Section
1-250
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