HCS12COREUG View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
MFG CO.
'HCS12COREUG' PDF : 124 Pages View PDF
MC9S12H256 Device User Guide — V01.14
TJ = TA + (PD • ΘJA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
PD = Total Chip Power Dissipation, [W]
ΘJA = Package Thermal Resistance, [°C/W]
The total power dissipation can be calculated from:
PD = PINT + PIO
PINT = Chip Internal Power Dissipation, [W]
PINT = IDDR ⋅ VDDR + IDDA ⋅ VDDA
∑ PIO = i RDSON ⋅ IIOi2
PIO is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
Table A-5 Thermal Package Characteristics1
Num C
Rating
Symbol Min
Typ
1 T Thermal Resistance LQFP112, single sided PCB2
θJA
–
–
Thermal Resistance LQFP112, double sided PCB
2 T with 2 internal planes3
θJA
–
–
3 T Thermal Resistance LQFP 144, single sided PCB
θJA
–
–
4
T
Thermal Resistance LQFP 144, double sided PCB
with 2 internal planes
θJA
–
–
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
45
37
Unit
oC/W
oC/W
oC/W
oC/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
88
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