HDMI05-CL01F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'HDMI05-CL01F3' PDF : 8 Pages View PDF
Package information
Figure 13. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
Figure 14. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
HDMI05-CL01F3
xxz
y ww
Figure 15. Flip-Chip tape and reel specification
Dot identifyng Pin A1 location
4.0 ± 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
1.24
4.0 ± 0.1
User direction of unreeling
6/8
Doc ID 17458 Rev 1
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