HMMC-2006 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
MFG CO.
'HMMC-2006' PDF : 6 Pages View PDF
960
RF
OUT2
460
610
SEL1
SEL2
1070
995
RF
OUT1
880
730
Chip ID
RF
IN
75
0
0
535
Figure 6. HMMC-2006 Bonding Pad Locations. (Dimensions in micrometers)
This data sheet contains a variety of typical and guaranteed performance data. The
information supplied should not be interpreted as a complete list of circuit specifica-
tions. In this data sheet the term typical refers to the 50th percentile performance. For
additional information contact your local HP sales representative.
7-25
Share Link: 
