HPL1117-25VC-TRL View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
HPL1117-25VC-TRL
Unspecified
'HPL1117-25VC-TRL' PDF : 19 Pages View PDF
HPL1117
Application Information (Cont.)
Thermal Considerations (Cont.)
60
TA=25°C
55
50
45
40
35
30
0
2
4
6
8
10 12 14
Top Copper Area (cm2)
Figure 4.
θ(J-A) vs. copper area for the SOT-223 package
The thermal resistance for each application will be
affected by thermal interactions with other compo-
nents on the board. Some experimentation will be
necessary to determine the actual value.
The power dissipation of HPL1117 is equal to :
PD = (VIN - VOUT) x IOUT
Maximum junction temperature is equal to :
TJUNCTION = TAMBIENT + (PD x θJA)
Note: TJUNCTION must not exceed 125°C
Copyright HIPAC Semiconductor, Inc.
12
Rev. B.13 - Mar., 2004
www.hipacsemi.com
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