HSMJ-T425 View Datasheet(PDF) - HP => Agilent Technologies

Part Name

Description

MFG CO.

HSMJ-T425

Surface Mount High Performance AlInGaP LED Indicators

HP => Agilent Technologies 

1 2 3 4 5

Recommended Printed Circuit Board Attachment Pad Geometries

INFRARED/VAPOR PHASE

REFLOW SOLDERING

4.45

(0.175)

COMPONENT LOCATION

ON PAD

2.41

(0.095)

1.65

(0.065)

CONDUCTIVE ATTACHMENT

4.45

(0.175)

2.41

(0.095)

1.65

(0.065)

0.64 (0.025) SQ.

CENTERED HOLE

COMPONENT LOCATION

ON PAD

NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

Convective IR Reflow

Soldering

For information on convective IR

reflow soldering, refer to the

Supplement to Application Note

1060, Surface Mounting SMT

LED Components.

1-203

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