HSP061-2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'HSP061-2' PDF : 12 Pages View PDF
Recommendation on PCB assembly
HSP061-2
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.4
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
4.5
Reflow profile
Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
10/12
DocID022777 Rev 2
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