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HT48C10 View Datasheet(PDF) - Holtek Semiconductor

Part Name
Description
MFG CO.
HT48C10
Holtek
Holtek Semiconductor Holtek
'HT48C10' PDF : 59 Pages View PDF
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HT48CXX/HT48RXX
Note: For the dice form, the TMR0 and TMR1 pads have to be bonded to VDD or VSS if the TMR0
and/or TMR1 pad are not used.
The (TMR0) INT indicates that the TMR0 pad should be bonded to the INT pin.
The PC5 (TMR1) indicates that the TMR1 pad should be bonded to the PC5 pin.
5
25th May ’99
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