ICS8343 View Datasheet(PDF) - Integrated Circuit Systems
Part Name
Description
MFG CO.
'ICS8343' PDF : 7 Pages View PDF
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE & DIMENSIONS
NOTE 3
-D-
NOTE 4
D
NOTE 5, 7
D1
NOTE 3
-A-
e
N/4 TIPS
4X
0.20 C A-B D
SEE DETA IL “A”
8 PLACES
11 / 13°
D/2
D1/2
NOTE 3
-B-
E1 E
NN
OO
TT
EE
5, 4
7
E/2
E1/2
A
-H- NOTE 2 / / 0.10 C
ccc
-C-
SEE DETA IL “B”
0.09 / 0.20
NOTE 9
b
ddd M C A-B S D S
WITH LEAD FINISH
0.09 / 0.16
b1
BASE MET AL
- 0.05 S
A2
DATUM
PLANE
-H-
A1
0.08
R. MIN.
0.20 MIN.
1.00 REF.
0° MIN.
0.08/0.20 R.
0.25
GAUGE PLANE
0° - 7 °
L
8343
6
www.icst.com
ICS8343
LOW SKEW 1-TO-16
FANOUT BUFFER
e/2
-A, B, OR -D-
b
-A, B, OR -D-
NOTES:
1. ALL DIMENSIONS AND TOLERANCING CONFORM TO
ANSI Y14.5-1982
2. DATUM PLANE -H- LOCATED AT MOLD PARTING
LINE AND COINCIDENT WITH LEAD, WHERE LEAD
EXITS PLASTIC BODY AT BOTTOM OF PARTING LINE.
3. DATUMS A-B AND -D- TO BE DETERMINED AT
CENTERLINE BETWEEN LEADS WHERE LEADS EXIT
PLASTIC AT DATUM PLANE -H- .
4. TO BE DETERMINED AT SEATING PLACE -C- .
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION.
6. N IS THE TOTAL NUMBER OF TERMINALS.
7. THESE DIMENSIONS TO BE DETEREMINED AT DATUM
PLANE -H-.
8. PACKAGE TOP DIMENSIONS ARE SMALLER THAN
BOTTOM DIMENSIONS AND TOP OF PACKAGE WILL
NOT OVERHANG BOTTOM OF PACKAGE.
9. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08mm TOTAL IN EXCESS OF THE b
DIMENSION AT MAXIMUM MATERIAL CONDITION.
10. CONTROLLING DIMENSION: MILLIMETER.
11. THIS OUTLINE CONFORMS TO JEDEC PUBLIBCATION
95 REGISTRATION MS-026, VARIATION BBA.
12. A1 IS DEFINED AS THE DISTANCE FROM THE
SEATING PLANE TO THE LOWEST POINT OF THE
PACKAGE.
S
JEDEC VARIATION
Y
ALL DIMENSIONS IN MILLIMETERS
N
M
O
B
T
O
BBA
E
L
MIN
NOM
MAX
A
1.60
A1
0.05
0.15
12
A2
1.35
1.4
1.45
D
9.00 BSC.
4
D1
7.00 BSC.
7, 8
E
9.00 BSC.
4
E1
7.00 BSC.
7, 8
L
0.45
0.60
0.75
N
32
e
0.80 BSC.
b
0.30
0.37
0.45
b1
0.30
0.35
0.40
9
ccc
0.10
ddd
0.20
REV. C, 07072000
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