Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - Y SUFFIX
PRELIMINARY
ICS8344
LOW SKEW, 1-TO-24
DIFFERENTIAL-TO-LVCMOS FANOUT BUFFER
D
D2
θ
52
40
1
39
L
2
3
E E1
E2
N
13
27
14
26
e
A A2
ccc C
A1
D1
-C-
SEATING
PLANE
b
c
TABLE 6. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
SYMBOL
MINIMUM
BCC
NOMINAL
N
48
A
A1
0.05
A2
1.35
1.40
b
0.17
0.22
c
0.09
D
9.00 BASIC
D1
7.00 BASIC
D2
5.50
E
9.00 BASIC
E1
7.00 BASIC
E2
5.50
e
0.5 BASIC
L
0.45
0.60
q
0°
ccc
Reference Document: JEDEC Publication 95, MS-026
MAXIMUM
1.60
0.15
1.45
0.27
0.20
0.75
7°
0.08
8344
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14
REV. B FEBRUARY 2, 2001