ICS83905AMLF View Datasheet(PDF) - Integrated Device Technology
Part Name
Description
MFG CO.
'ICS83905AMLF' PDF : 19 Pages View PDF
ICS83905
LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS/LVTTL FANOUT BUFFER
PACKAGE OUTLINE - M SUFFIX FOR 16 LEAD SOIC
PACKAGE OUTLINE - G SUFFIX FOR 16 LEAD TSSOP
TABLE 8A. PACKAGE DIMENSIONS FOR 16 LEAD SOIC
SYMBOL
Millimeters
MINIMUM
MAXIMUM
N
16
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
9.80
10.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
TABLE 8B. PACKAGE DIMENSIONS FOR TSSOP
SYMBOL
N
A
A1
A2
b
c
D
E
E1
e
L
α
aaa
Millimeters
Minimum
Maximum
16
--
1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.09
0.20
4.90
5.10
6.40 BASIC
4.30
4.50
0.65 BASIC
0.45
0.75
0°
8°
--
0.10
IDT™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
15
ICS83905AM REV. B JULY 9, 2007
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