Integrated
Circuit
Systems, Inc.
PRELIMINARY
ICS83905
LOW SKEW, 1:6 CRYSTAL INTERFACE-TO-
LVCMOS / LVTTL FANOUT BUFFER
PACKAGE OUTLINE - M SUFFIX FOR 16 LEAD SOIC
PACKAGE OUTLINE - G SUFFIX FOR 16 LEAD TSSOP
TABLE 7A. PACKAGE DIMENSIONS FOR 16 LEAD SOIC
SYMBOL
Millimeters
MINIMUM
MAXIMUM
N
16
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
9.80
10.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
TABLE 7B. PACKAGE DIMENSIONS FOR TSSOP
SYMBOL
Millimeters
Minimum
Maximum
N
16
A
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
4.90
5.10
E
6.40 BASIC
E1
4.30
4.50
e
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
83905AM
http://www.icst.com/products/hiperclocks.html
REV. A JANUARY 20, 2005
12