ICS853001AGLF View Datasheet(PDF) - Integrated Circuit Systems
Part Name
Description
MFG CO.
ICS853001AGLF
Integrated Circuit Systems
'ICS853001AGLF' PDF : 16 Pages View PDF
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX FOR 8 LEAD TSSOP
ICS853001
1:1, DIFFERENTIAL LVPECL-TO-
2.5V, 3.3V, 5V LVPECL/ECL BUFFER
PACKAGE OUTLINE - M SUFFIX FOR 8 LEAD SOIC
TABLE 7A. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
Maximum
N
8
A
--
1.10
A1
0
0.15
A2
0.79
0.97
b
0.22
0.38
c
0.08
0.23
D
3.00 BASIC
E
4.90 BASIC
E1
3.00 BASIC
e
0.65 BASIC
e1
1.95 BASIC
L
0.40
0.80
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-187
TABLE 7B. PACKAGE DIMENSIONS
SYMBOL
Millimeters
MINIMUN
MAXIMUM
N
8
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
853001AG
www.icst.com/products/hiperclocks.html
15
REV. A JANUARY 29, 2005
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