ICS932S200 View Datasheet(PDF) - Integrated Circuit Systems
Part Name
Description
MFG CO.
ICS932S200
Integrated Circuit Systems
'ICS932S200' PDF : 12 Pages View PDF
ICS932S200
N
c
INDEX
AREA
12
D
E1 E
L
a
A2
A
A1
-C-
e
b
SEATING
PLANE
aaa C
6.10 mm. Body, 0.50 mm. pitch TSSOP
(240 mil)
(0.020 mil)
SYMBOL
A
A1
A2
b
c
D
E
E1
e
L
N
α
aaa
In Millimeters
In Inches
COMMON DIMENSIONS COMMON DIMENSIONS
MIN
MAX
MIN
MAX
--
1.20
--
.047
0.05
0.15
.002
.006
0.80
1.05
.032
.041
0.17
0.27
.007
.011
0.09
0.20
.0035
.008
SEE VARIATIONS
SEE VARIATIONS
8.10 BASIC
0.319 BASIC
6.00
6.20
.236
.244
0.50 BASIC
0.020 BASIC
0.45
0.75
.018
.030
SEE VARIATIONS
SEE VARIATIONS
0°
8°
0°
8°
--
0.10
--
.004
VARIATIONS
N
56
D mm.
MIN
MAX
13.90
14.10
Reference Doc.: JEDEC Publication 95, MO-153
10-0039
D (inch)
MIN
MAX
.547
.555
Ordering Information
ICS932S200yG-T
Example:
ICS XXXX y G - PPP - T
Designation for tape and reel packaging
Pattern Number (2 or 3 digit number for parts with ROM code
patterns)
Package Type
G=TSSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
0427C—07/03/02
12
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