IS474 View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'IS474' PDF : 5 Pages View PDF
IS474
Fig. 11 Radiation Diagram (Right/Left Direction)
- 20˚ - 10˚ 0
+ 10˚ + 20˚
100
Vcc = 5V
Ta = 25˚C
- 30˚
80
+30˚
Fig. 12 Radiation Diagram (Top/Bottom Direction)
- 20˚ -10˚ 0
+10˚ +20˚
- 30˚
100
Vcc = 5V
Ta = 25˚C
+30˚
80
- 40˚
60
+40˚
- 40˚
+40˚
60
- 50˚
40
+50˚
- 60˚
+60˚
- 70˚
20
+70˚
- 80˚
+80˚
- 90˚
+90˚
0
Angular displacement θ
- 50˚
+50˚
40
- 60˚
+60˚
- 70˚
20
+70˚
- 80˚
+80˚
- 90˚
0
+90˚
Angular displacement θ
s Precautions for Operation
(1) It is recommended to connect a capacitor between VCC and GND near the device in order to stabilize power supply line
L
Device
Vcc
C
L<= 20 mm
C >= 0.01µ F
2 pieces of photodiodes are built in this device to amplify difference in collector current between them.
Radiation of even light to 2 pieces of photodiodes is recommended.
Radiation of uneven light may cause change of spectral sensitivity or starting failure of the circuit after power is supplied.
(2) Cleaning
• Conduct cleaning as follows.
Solvent dip cleaning : Solvent temperature of 45˚C max., dipping time : Within 3 minutes
Ultrasonic cleaning : Elements are affected differently depending on the size of cleaning bath, ultrasonic output, time, size of PWB and mounting
method of elements. Conduct trial cleaning on actual operating conditions in advance to make sure that no problem results.
• Use following solvents only.
Solvents : Ethyl alcohol, methyl alcohol and isopropyl alcohol
(3) Soldering
Be sure to perform soldering at values within the maximum ratings. Take care so that not external force is applied to
the lead during and immediately after soldering. Do not perform reflow soldering.
q Please refer to the chapter "Precautions for Use". (Page 78 to 93)
Share Link: 
