ISP847C View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'ISP847C' PDF : 15 Pages View PDF
ISP817, ISP827, ISP847
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
One Time Reflow Soldering is Recommended.
Do not immerse device body in solder paste.
260°C
TP
TP - 5°C
TL 217°C
Tsmax 200°C
Tsmin 150°C
Max Ramp Up Rate
3°C/s
ts Preheat
60s – 120s
tP
Max Ramp Down Rate
6°C/s
TL
25°C
Time 25°C to Peak Temperature
TIME (s)
Profile Details
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
Average Ramp Up Rate (Tsmax to TP)
Time 25°C to Peak Temperature
Conditions
150°C
200°C
60s - 120s
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
3°C/s max
8 minutes max
14 07/11/2017
DD93227
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