L6228 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6228' PDF : 34 Pages View PDF
L6228
Figure 28. PowerSO36 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
ºC / W
43
38
33
W ith o ut G ro u nd La yer
28
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
23
H o le s
On-Board Copper Area
18
13
1 2 3 4 5 6 7 8 9 10 1 1 1 2 13
sq. cm
Figure 29. PowerDIP24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
ºC / W
49
48
C o p pe r Are a is o n Bo tto m
S id e
47
46
C o p pe r Are a is o n To p S i de
45
44
43
42
41
40
39
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
On-Board Copper Area
Figure 30. SO24 Junction-Ambient Thermal Resistance versus On-Board Copper Area.
ºC / W
68
66
64
62
60
C o pp er A re a is o n T op S id e
58
56
54
52
50
48
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
On-Board Copper Area
Figure 31. Mounting the PowerSO Package.
22/26
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
Share Link: 
