L6390 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6390' PDF : 22 Pages View PDF
L6390
10 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Figure 8. DIP-16 mechanical data and package dimensions
DIM.
MIN.
mm
TYP.
MAX.
MIN.
inch
TYP. MAX.
a1 0.51
0.020
B 0.77
1.65 0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
17.78
0.700
F
7.1
0.280
I
5.1
0.201
L
3.3
0.130
Z
1.27
0.050
OUTLINE AND
MECHANICAL DATA
DIP16
19/22
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